Chia-Feng Hsiao

Title: Innovations by Chia-Feng Hsiao

Introduction

Chia-Feng Hsiao is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of wafer defect detection, holding a total of 2 patents. His work focuses on improving the quality and reliability of semiconductor manufacturing processes.

Latest Patents

Chia-Feng Hsiao's latest patents include a wafer backside defect detection method and a wafer backside defect detection apparatus. The wafer backside defect detection method involves cropping off a peripheral edge area of a wafer backside image where at least one notch is located. It connects adjacent white pixels on the wafer backside image to identify multiple abnormal regions. If the total area of the top N abnormal regions exceeds 10% of the wafer's area, it indicates a roughness defect. Conversely, if this area is less than 1% and the largest abnormal region exceeds a predetermined length, it suggests a scratch defect. Additionally, he has developed an automatic detection method and system for identifying cracks on wafer edges. This method integrates several wafer images to create a template image, which is then used to detect edge cracks through a series of image processing steps.

Career Highlights

Chia-Feng Hsiao is currently employed at United Microelectronics Corporation, a leading semiconductor foundry. His expertise in wafer defect detection has positioned him as a valuable asset in the industry.

Collaborations

He has collaborated with notable coworkers, including Chung-Hsuan Wu and Nai-Ying Lo, contributing to advancements in semiconductor technology.

Conclusion

Chia-Feng Hsiao's innovative work in wafer defect detection showcases his commitment to enhancing semiconductor manufacturing processes. His contributions are vital for ensuring the quality and reliability of electronic components.