This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2002.
Company Filing History:
Years Active: 2002
Title: Chia-Da Hsieh: Innovator in Semiconductor Technology
Introduction
Chia-Da Hsieh is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the fabrication of split gate field effect transistors (FETs). His innovative approaches have led to advancements in microelectronic fabrication processes.
Latest Patents
Chia-Da Hsieh holds a patent for a method titled "Sacrificial self aligned spacer layer ion implant mask method for forming a split gate field effect transistor (FET) device." This patent describes a method for fabricating a split gate FET within a semiconductor integrated circuit. The process involves using a sacrificial self-aligned spacer layer that defines a control gate electrode channel. This layer serves as an ion implantation mask for forming a source/drain region adjacent to the control gate electrode channel. The sacrificial layer is removed before the formation of the control gate electrode, enhancing the efficiency of the fabrication process.
Career Highlights
Chia-Da Hsieh has been associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work has focused on improving the methods used in semiconductor fabrication, contributing to the advancement of technology in this critical field.
Collaborations
Chia-Da Hsieh has collaborated with notable colleagues, including Di-Son Kuo and Jake Yeh. These collaborations have fostered innovation and have been instrumental in the development of new technologies within the semiconductor sector.
Conclusion
Chia-Da Hsieh's contributions to semiconductor technology, particularly through his patented methods, highlight his role as an influential inventor in the industry. His work continues to impact the field of microelectronics, paving the way for future innovations.