Tainan, Taiwan

Chia-Chan Tsai

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: United Microelectronics Corp.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Chan Tsai. Retrieved from https://idiyas.com/inventor/chia-chan-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chia-Chan Tsai and Semiconductor Probe Calibration

Introduction

Chia-Chan Tsai is an inventor based in Tainan, Taiwan, and is associated with United Microelectronics Corporation. His patent work addresses calibration of testing probe sets used in semiconductor manufacturing.

Latest Patents

Tsai is credited with 1 patent: “Automatic Calibration Method and Automatic Calibration Equipment for Testing Probe Set Used in Semiconductor Process.” The invention describes a method for calibrating a test probe set by analyzing its empirical needle mark to determine a preliminary correction offset. The probe set’s position relative to the wafer is adjusted, and the set is used to test the wafer. If the resulting offset exceeds a predetermined specification, the relative position is adjusted further.

Career Highlights

The patent focuses on improving the calibration process for semiconductor testing equipment. Its approach combines an initial position adjustment with a test procedure and a subsequent correction when the measured offset falls outside the specified range.

Collaborations

The patent identifies United Microelectronics Corporation as Tsai’s company affiliation. The provided information does not specify additional collaborators.

Conclusion

Chia-Chan Tsai’s patent presents a systematic approach to calibrating semiconductor test probes, using wafer testing and offset checks to guide position adjustments.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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