The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Jan. 08, 2024
United Microelectronics Corp., Hsinchu, TW;
Zheng-Yang Li, Kaohsiung City, TW;
Chia-Chan Tsai, Tainan City, TW;
UNITED MICROELECTRONICS CORP., Hsinchu, TW;
Abstract
An automatic calibration method and an automatic calibration equipment for a testing probe set used in a semiconductor process are provided. The automatic calibration method of the test probe set used in the semiconductor manufacturing process includes the following steps. A preliminary correction offset is analyzed according to an empirical needle mark of the test probe set. A relative position between the test probe set and a wafer to be tested are preliminarily adjusted according to the preliminary correction offset. The test probe set is used to perform a test procedure on the wafer to be tested. Whether the offset of the test probe set is within a predetermined specification is determined. If the offset of the test probe set exceeds the predetermined specification, the relative position between the test probe set and the wafer to be tested is further adjusted.