Company Filing History:
Years Active: 2015-2019
Title: **Innovative Contributions of Chi-Ming Liao in Semiconductor Technology**
Introduction
Chi-Ming Liao, an accomplished inventor based in Hsin-Chu, Taiwan, has made significant contributions to the field of semiconductor technology. With a portfolio of four patents, Liao’s inventions focus on enhancing semiconductor film applications, which are crucial for modern electronic devices.
Latest Patents
Among his notable patents is the "Semiconductor Film with Adhesion Layer and Method for Forming the Same." This patent outlines a sophisticated device featuring an insulator layer situated over a substrate, with an adhesion layer positioned atop the insulator. The adhesion layer comprises a semiconductor oxide, which is a compound of a semiconductor element and oxygen. Over this adhesion layer lies a semiconductor film layer, composed of the semiconductor element but differing in composition from the adhesion layer itself. Notably, the bonds at the interface between the insulator layer and the adhesion layer include oxygen-hydrogen bonds as well as oxygen-semiconductor element bonds. This innovative approach enables enhanced performance in gate-last transistor structures.
Career Highlights
Chi-Ming Liao has dedicated his expertise to Taiwan Semiconductor Manufacturing Company Ltd. Throughout his career, Liao has continually improved semiconductor processes and materials, contributing to the advancement of reliable and efficient electronic circuitry.
Collaborations
Collaboration has been a key aspect of Liao’s success, especially working alongside talented colleagues such as Chun-Heng Chen and Sheng-Po Wu. Their teamwork has fostered an environment where innovative ideas can flourish, leading to the creation of groundbreaking technologies in the semiconductor industry.
Conclusion
In summary, Chi-Ming Liao's innovative contributions to semiconductor technology through his patents, along with his collaborative efforts, underscore his role as a prominent inventor in advancing the field. His work not only enhances existing technologies but also paves the way for future innovations in the semiconductor industry.