The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Dec. 16, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chi-Ming Liao, Hsin-Chu, TW;

Chun-Heng Chen, Hsin-Chu, TW;

Sheng-Po Wu, Zhongli, TW;

Ming-Feng Hsieh, New Taipei, TW;

Hongfa Luan, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 21/762 (2006.01); H01L 23/535 (2006.01); H01L 29/51 (2006.01); H01L 29/78 (2006.01); H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0649 (2013.01); H01L 21/0262 (2013.01); H01L 21/02123 (2013.01); H01L 21/02381 (2013.01); H01L 21/02488 (2013.01); H01L 21/02502 (2013.01); H01L 21/02532 (2013.01); H01L 21/7624 (2013.01); H01L 21/76243 (2013.01); H01L 21/84 (2013.01); H01L 23/535 (2013.01); H01L 27/1203 (2013.01); H01L 29/0684 (2013.01); H01L 29/517 (2013.01); H01L 29/6678 (2013.01); H01L 29/66545 (2013.01); H01L 29/78 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Presented herein is a device including an insulator layer disposed over a substrate. An adhesion layer is disposed over the insulator layer and includes a semiconductor oxide, the semiconductor oxide including a compound of a semiconductor element and oxygen. A semiconductor film layer is over the adhesion layer, the semiconductor film layer being a material including the semiconductor element, the semiconductor film layer having a different composition than the adhesion layer. Bonds at an interface between the insulator layer and the adhesion layer comprise oxygen-hydrogen bonds and oxygen-semiconductor element bonds.


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