Chi Ling Shum

Title: Innovations of Chi Ling Shum

Introduction

Chi Ling Shum is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronics, holding a total of 3 patents. His work focuses on developing advanced electronic devices and methods that enhance functionality and efficiency.

Latest Patents

One of his latest patents is titled "Electronic device and method of making same." This invention describes an electronic device that features a first surface, a second surface opposite to the first surface, and sidewalls that connect the two surfaces. The device includes contact pads on the first surface that extend to the adjoining sidewalls, ensuring effective connectivity. Another significant patent is "Built-up lead frame package and method of making thereof." This patent outlines a semiconductor device that comprises a device die with bond pads for connection to its circuitry. The device includes a built-up substrate lead frame, which is enveloped in a molding compound, facilitating the attachment of the device die and ensuring reliable electrical connections.

Career Highlights

Chi Ling Shum has worked with prominent companies in the electronics industry, including Nexperia B.V. and NXP B.V. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects that push the boundaries of technology.

Collaborations

Throughout his career, Chi Ling Shum has collaborated with talented individuals such as Shun Tik Yeung and Pompeo V Umali. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Chi Ling Shum's contributions to the field of electronics through his patents and collaborations highlight his innovative spirit and dedication to advancing technology. His work continues to influence the industry and inspire future inventors.