Chi-Lien Lin

Title: Innovations by Chi-Lien Lin in Semiconductor Technology

Introduction

Chi-Lien Lin is a notable inventor based in Chia-Yi, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of improving the profile of via or contact holes in insulator layers. His innovative methods have the potential to enhance the performance and reliability of semiconductor devices.

Latest Patents

Chi-Lien Lin holds a patent for a method to improve via or contact hole profile using an in-situ polymer deposition and strip procedure. This method involves forming a narrow diameter opening in an insulator layer with a vertical shape profile. The process begins with a first plasma procedure that creates an initial opening with a tapered profile shape. A thin polymer layer is formed at the bottom of this opening. A second plasma procedure, performed in situ, deposits an additional polymer layer at the bottom of the initial opening. Finally, a third plasma procedure in an oxygen plasma removes the polymer and etches portions of the insulator layer, resulting in a final opening with a vertical profile shape.

Career Highlights

Chi-Lien Lin is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work has contributed to advancements in manufacturing processes that are crucial for the production of high-performance semiconductor devices.

Collaborations

Chi-Lien Lin has collaborated with notable colleagues, including Chuan-Chieh Huang and Feng-Yueh Chang. Their teamwork has fostered an environment of innovation and excellence in semiconductor research and development.

Conclusion

Chi-Lien Lin's contributions to semiconductor technology through his innovative patent demonstrate his expertise and commitment to advancing the field. His work continues to influence the development of more efficient semiconductor manufacturing processes.