Company Filing History:
Years Active: 2019
Title: **Chi-Hung Pan: Innovator in Semiconductor Device Packaging**
Introduction
Chi-Hung Pan is a distinguished inventor based in Kaohsiung, Taiwan, recognized for his contributions to semiconductor technology. His innovative approach to semiconductor device packaging has led to the development of a notable patent that enhances the efficiency and reliability of these devices.
Latest Patents
Chi-Hung Pan holds a patent for a "Semiconductor device package having an underfill barrier." This innovative semiconductor device package comprises a substrate and a semiconductor device, with a unique underfill placement designed to improve functionality. The substrate features a top surface that defines a mounting area and includes a barrier section adjacent to this area. The semiconductor device is mounted precisely on the substrate, with the underfill material positioned between the semiconductor device and the mounting area, as well as the barrier section. Notably, the patent details that the contact angle between the surface of the underfill and the barrier section is greater than or equal to about 90 degrees, which is crucial for enhancing performance and preventing defects.
Career Highlights
Chi-Hung Pan has made significant strides in his career at Advanced Semiconductor Engineering, Inc., a leading company in the semiconductor industry. His innovative mindset and technical expertise have positioned him as a key inventor within the organization, contributing to its reputation for excellence and innovation in semiconductor packaging solutions.
Collaborations
Throughout his career, Chi-Hung Pan has collaborated with talented colleagues, including Jin-Yuan Lai and Tang-Yuan Chen. Together, they have worked on various projects that leverage their collective expertise, further advancing semiconductor technologies and contributing to the development of cutting-edge packaging solutions.
Conclusion
Chi-Hung Pan's inventive work has made a meaningful impact in the realm of semiconductor devices, showcasing the importance of innovation in this field. His patent on semiconductor device packaging not only represents a significant advancement in technology but also highlights the ongoing commitment to improving device performance and reliability in the industry.