The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Jun. 09, 2017
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Jin-Yuan Lai, Kaohsiung, TW;
Tang-Yuan Chen, Kaohsiung, TW;
Ying-Xu Lu, Kaohsiung, TW;
Dao-Long Chen, Kaohsiung, TW;
Kwang-Lung Lin, Kaohsiung, TW;
Chih-Pin Hung, Kaohsiung, TW;
Tse-Chuan Chou, Kaohsiung, TW;
Ming-Hung Chen, Kaohsiung, TW;
Chi-Hung Pan, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.