Hsinchu, Taiwan

Chi-Fu Lin

This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2017-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chi-Fu Lin. Retrieved from https://idiyas.com/inventor/chi-fu-lin-kgbzkrdx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 4 

% Patents Active = 75.0

Average Co-Inventor Count = 4.7

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Hsinchu County, TW (2017)
  • Zhubei, TW (2023)

Company Filing History:


Years Active: 2017-2025

Loading Chart...
4 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Chi-Fu Lin

Introduction: Chi-Fu Lin, a pioneering inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents: Chi-Fu Lin holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a background in engineering and a passion for pushing the boundaries of what is possible, Chi-Fu Lin has had a successful career marked by groundbreaking inventions that have shaped industries and improved lives.

Collaborations: Throughout his career, Chi-Fu Lin has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life and make a lasting impact on the world of innovation.

Conclusion: Chi-Fu Lin's relentless pursuit of innovation and his dedication to creating solutions for complex challenges have solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…