Chew Ching Lim

Title: Chew Ching Lim: Innovator in Semiconductor Technology

Introduction

Chew Ching Lim is a notable inventor based in Bayan Lepas, Malaysia. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is titled "Stiffener for die crack prevention in semiconductor packages." This invention relates to a semiconductor package that includes a substrate and at least one die coupled to the substrate. The design features a stiffener that may include a stiffener frame, which at least partially surrounds the die. Additionally, the stiffener incorporates at least one resilient member extending from the frame towards the die, with a distal end that extends above the substrate.

Another significant patent is the "Bathtub integrated heat spreader with multiple thermal-interface material for integrated-circuit packages." This invention includes multiple thermal-interface materials at the interface between an integrated heat spreader and a heat sink. The primary thermal-interface material possesses flow qualities, while the secondary material has containment and adhesive qualities. The integrated heat spreader is designed with a basin form factor that contains the primary thermal-interface material.

Career Highlights

Chew Ching Lim is currently employed at Intel Corporation, a leading company in semiconductor manufacturing and technology. His work at Intel has allowed him to contribute to cutting-edge innovations in the industry.

Collaborations

He has collaborated with notable coworkers, including Chun Howe Sim and Eng Kwong Lee, who share a commitment to advancing semiconductor technology.

Conclusion

Chew Ching Lim's contributions to semiconductor technology through his patents and work at Intel Corporation highlight his role as an influential inventor in the field. His innovative designs continue to impact the industry positively.