The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Nov. 04, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Eng Kwong Lee, Pinang, MY;
Chew Ching Lim, Pinang, MY;
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/16 (2006.01); H01L 23/367 (2006.01); H01L 23/427 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4882 (2013.01); H01L 23/16 (2013.01); H01L 23/3672 (2013.01); H01L 23/427 (2013.01);
Abstract
The present disclosure relates to a semiconductor package that may include a substrate, at least one die coupled to the substrate, and a stiffener coupled to the substrate, wherein the stiffener may include a stiffener frame, wherein the stiffener frame at least partially surrounds the at least one die. The stiffener may include at least one resilient member extending from the stiffener frame towards the at least one die, and the at least one resilient member may include a distal end that extends at a height above the substrate.