Eng Kwong Lee

Title: Eng Kwong Lee: Innovating Semiconductor Technologies

Introduction

Eng Kwong Lee is an accomplished inventor based in Pinang, Malaysia, known for his significant contributions to semiconductor technology. With a total of two patents to his name, he has made strides in developing innovative solutions that enhance the performance and reliability of multi-chip packages.

Latest Patents

Eng Kwong Lee's recent inventions showcase his expertise and forward-thinking approach in the semiconductor field. His first notable patent is the "Conformable heat sink pedestal for multi-chip packages." This invention introduces a heat sink pedestal made from a composite material that improves thermal management by utilizing layers of both thermally conductive primary and secondary materials. The design allows for a conductivity ratio that optimizes performance, making the pedestal adaptable to the shapes of semiconductor chips.

The second patent, "Stiffener for die crack prevention in semiconductor packages," further demonstrates his innovative mindset. This invention involves a semiconductor package that incorporates a substrate with at least one die attached. It features a robust stiffener that includes a frame to partially surround the die, providing added stability. The inclusion of resilient members extending from the stiffener frame enhances the package’s durability, specifically addressing die crack issues.

Career Highlights

Eng Kwong Lee works for Intel Corporation, a leading company in the semiconductor industry known for its pioneering technologies. Throughout his career at Intel, he has been instrumental in driving advancements that support the complexity and performance demands of modern electronic devices. His dual patents reflect his deep commitment to innovation and technological excellence.

Collaborations

In his role at Intel Corporation, Eng has collaborated with other talented engineers and inventors, including Tung Lun Loo and Chew Ching Lim. These collaborations have fostered an environment of teamwork and idea exchange, crucial for achieving significant breakthroughs in semiconductor technology.

Conclusion

Eng Kwong Lee's achievements in the realm of semiconductor innovations illustrate the important role inventors play in pushing the boundaries of technology. His patents for conformable heat sink pedestals and die crack prevention stiffeners not only enhance semiconductor package efficiency but also exemplify his dedication to solving industry challenges. As the field continues to evolve, Lee's contributions stand as a testament to the impact of inventive minds on technological progress.