Chengzeng Xu

Title: Innovations of Chengzeng Xu

Introduction

Chengzeng Xu is a notable inventor based in Succasunna, NJ (US). He has made significant contributions to the field of electronic substrates and printed wiring boards. With a total of 10 patents to his name, his work has advanced the technology used in high-density electronic applications.

Latest Patents

One of his latest inventions is the "Lasable bond-ply materials for high density printed wiring boards." This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply to manufacture high-density multilayer printed wiring boards. Another significant patent is for "Microfiber dielectrics which facilitate laser via drilling." This invention involves electronic substrates comprising a non-woven filler material and a resin material. It also includes electronic products manufactured from these substrates, such as prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. Furthermore, it outlines a method of manufacturing printed built-up wiring boards, which includes forming a prepreg and creating at least one via in the prepreg.

Career Highlights

Chengzeng Xu has worked with prominent companies in the industry, including Honeywell International Inc. and Corning Incorporated. His experience in these organizations has contributed to his expertise in developing innovative materials and technologies.

Collaborations

Throughout his career, Chengzeng has collaborated with notable colleagues such as David R. Haas and James T. Yardley. These collaborations have likely enriched his work and led to further advancements in his field.

Conclusion

Chengzeng Xu's contributions to the field of electronic substrates and printed wiring boards demonstrate his innovative spirit and technical expertise. His patents reflect a commitment to advancing technology in high-density applications.