Honeywell International Inc.

Corning Incorporated

Isola Laminate Systems Corporation

Alliedsignal Inc.

Chengzeng Xu

James T Yardley

David R Haas

Lawrence W Shacklette

Louay A Eldada

Mavyn McAuliffe

Scott Moore Zimmerman

Chengjiu Wu

Richard J Pommer

Kelly M Stengel

Meifang Qin

Baopei Xu

Kelly M T Stengel

Laura Miller

Keith A Horn

Michael A Petti

Jeffrey T Gotro

Ming Mei Huang

Michael Vallance

Laura M Leyrer

This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.

Lasable bond-ply materials for high density printed wiring boards

This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.

Microfiber dielectrics which facilitate laser via drilling

The invention provides organic optical waveguide devices which are lithographically formed and employ polymeric materials having low optical loss, good long term and short term stability, good flexibility and reduced stress or crack induced scattering loss. An optical element has a substrate; a patterned, light transmissive core composition on the surface of the substrate; and a light reflecting cladding composition on the pattern of the core. The core composition has a glass transition temperature of about 80&deg; C. or less and the cladding composition has a glass transition temperature of about 60&deg; C. or less.

High performance acrylate materials for optical interconnects

High density built-up multilayer printed circuit boards are produced by constructing microvias with photoimageable dielectric materials. A photosensitive dielectric composition on a conductive foil is laminated to conductive lines on a core. After imaging the foil and imaging and curing the photosensitive dielectric composition, vias are formed to the conductive lines. Thereafter the conductive lines are connected through the vias to the conductive foil, and then the conductive foil is patterned.

Fabrication of high density multilayer interconnect printed circuit boards

Positive acting photodielectric composition

The invention provides improved high contrast, photopolymerizable compositions suitable for producing high contrast waveguides. The high contrast, photopolymerizable compositions of this invention include a nitrone compound component. The photosensitive composition is an admixture of a free radical polymerizable acrylate or methacrylate component having at least two ethylenically unsaturated groups, a photoinitiator, and a nitrone compound.

Nitrone compounds as photopolymer polymerization inhibitors and contrast

The invention provides a low stress optical waveguide assembly wherein one or more waveguide cores have a conformal cladding in register the waveguide core. The core and cladding are preferably lithographically formed on a substrate. A connector assembly provides for the precision interconnection of mating arrays of parallel optical waveguides. The connector assembly has a base with several parallel channel walls cut along a surface of the base. A waveguide assembly is positioned on the base. The waveguide assembly comprises a substrate and one or more transparent, polymeric waveguides on and raised from a surface of the substrate. A conformal cladding is in register with the waveguide core. Such conformal cladding contributes to a reduction in waveguide stress. The waveguide assembly is positioned on the base such that each of the waveguides is set in one of the channels and contacts the walls of the channel. A cover plate holds the waveguide assembly on the base.

Low stress optical waveguide having conformal cladding and fixture for

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Succasunna, NJ, United States of America

Chengzeng Xu