The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2001
Filed:
Apr. 03, 1998
Chengzeng Xu, Succasunna, NJ (US);
James T. Yardley, Morristown, NJ (US);
David Haas, Westfield, NJ (US);
Michael Vallance, La Crosse, WI (US);
Jeffrey T. Gotro, Onalaska, WI (US);
Michael A. Petti, Buffalo Grove, IL (US);
Isola Laminate Systems Corp., LaCrosse, WI (US);
Abstract
High density built-up multilayer printed circuit boards are produced by constructing microvias with photoimageable dielectric materials. A photosensitive dielectric composition on a conductive foil is laminated to conductive lines on a core. After imaging the foil and imaging and curing the photosensitive dielectric composition, vias are formed to the conductive lines. Thereafter the conductive lines are connected through the vias to the conductive foil, and then the conductive foil is patterned.