Michael Vallance

Title: Michael Vallance: Innovator in High Density Multilayer Printed Circuit Boards

Introduction

Michael Vallance is a notable inventor based in La Crosse, WI (US). He has made significant contributions to the field of printed circuit board technology. His innovative work focuses on the fabrication of high-density multilayer interconnect printed circuit boards.

Latest Patents

Vallance holds a patent for the "Fabrication of high density multilayer interconnect printed circuit boards." This patent describes a process for producing high-density built-up multilayer printed circuit boards by constructing microvias with photoimageable dielectric materials. The method involves laminating a photosensitive dielectric composition on a conductive foil to conductive lines on a core. After imaging the foil and curing the photosensitive dielectric composition, vias are formed to connect the conductive lines. The conductive lines are then connected through the vias to the conductive foil, which is subsequently patterned. Vallance's patent represents a significant advancement in the manufacturing of printed circuit boards, enhancing their functionality and efficiency.

Career Highlights

Michael Vallance is associated with Isola Laminate Systems Corporation, where he applies his expertise in printed circuit board technology. His work has contributed to the development of advanced materials and processes that are essential in the electronics industry.

Collaborations

Vallance has collaborated with notable colleagues, including Chengzeng Xu and James T Yardley. These partnerships have fostered innovation and have been instrumental in advancing the technology in their field.

Conclusion

Michael Vallance's contributions to the field of printed circuit boards exemplify the spirit of innovation. His patent and work at Isola Laminate Systems Corporation highlight his role as a key figure in advancing technology in this area.