The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2004
Filed:
Apr. 04, 2001
Applicant:
Inventors:
David Haas, Westfield, NJ (US);
Chengzeng Xu, Succasunna, NJ (US);
Mavyn McAuliffe, Waltham, MA (US);
Scott Zimmerman, Baskingridge, NJ (US);
Laura Miller, Mount Airy, NC (US);
Meifang Qin, Branchburg, NJ (US);
Baopei Xu, Tewksbury, MA (US);
Richard Pommer, Trabuco Canyon, CA (US);
Assignee:
Honeywell International Inc., Morristown, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/100 ;
U.S. Cl.
CPC ...
B32B 3/100 ;
Abstract
This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.