Tewksbury, MA, United States of America

Baopei Xu


Average Co-Inventor Count = 8.0

ph-index = 2

Forward Citations = 33(Granted Patents)


Location History:

  • Lake Haiwatha, NJ (US) (2001)
  • Tewksbury, MA (US) (2004)

Company Filing History:


Years Active: 2001-2004

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2 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Baopei Xu - Pioneering High Density Printed Wiring Boards

Introduction:

Baopei Xu, a talented inventor based in Tewksbury, MA (US), has been making waves in the field of high density printed wiring boards. With a knack for innovation and problem-solving, Baopei Xu has secured two patents that are set to revolutionize the industry.

Latest Patents:

Baopei Xu's latest patents revolve around lasable bond-ply materials for high density printed wiring boards. These revolutionary materials comprise a nonwoven reinforcing material and at least one resin material. The innovative methods developed by Baopei Xu enable the creation of high density multilayer printed wiring boards, ushering in a new era of efficiency and performance in electronic devices.

Career Highlights:

Throughout his career, Baopei Xu has demonstrated a profound understanding of materials science and engineering. His dedication to pushing the boundaries of traditional manufacturing processes has led to the development of cutting-edge solutions for complex technological challenges. Baopei Xu's passion for innovation shines through in all his endeavors, reflecting his commitment to excellence.

Collaborations:

Baopei Xu has collaborated with esteemed colleagues such as David R. Haas and Chengzeng Xu. Together, they have pooled their expertise to create impactful technologies that address the evolving needs of the industry. Through collaboration and shared knowledge, Baopei Xu has been able to leverage the collective intelligence of his peers to drive meaningful change and progress.

Conclusion:

In conclusion, Baopei Xu stands out as a visionary inventor with a remarkable portfolio of patents that are poised to shape the future of high density printed wiring boards. His relentless pursuit of innovation and his collaborative spirit have positioned him as a leader in the field. As Baopei Xu continues to push the boundaries of what is possible, we can expect to see even more groundbreaking inventions from this trailblazing innovator.

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