Chengyan Liu

Title: Chengyan Liu: Innovator in Electronic Device Manufacturing

Introduction

Chengyan Liu is a prominent inventor based in Beijing, China. He has made significant contributions to the field of electronic device manufacturing, particularly in the development of advanced packaging technologies. With a total of 2 patents, Liu's work is at the forefront of innovation in this rapidly evolving industry.

Latest Patents

Liu's latest patents include a manufacturing method for Package in Package (PiP) electronic devices and a method for Flip Chip on Chip (FCoC) packages. The PiP patent describes a method that utilizes a multi-row Quad Flat No-lead (QFN) package, where the lower surface of the plate metallic base material is half-etched to create grooves. Insulation filling material is then added to these grooves. The upper surface is also half-etched to form a chip pad and multiple leads. This process culminates in the encapsulation of an integrated circuit (IC) chip, leading to the formation of a multi-row QFN package as an inner package. The FCoC patent similarly employs a multi-row QFN package, detailing a method that involves encapsulating two IC chips and forming an array of FCoC packages.

Career Highlights

Chengyan Liu is affiliated with the Beijing University of Technology, where he continues to advance his research and development efforts. His innovative approaches to electronic device packaging have positioned him as a key figure in the field. Liu's work not only enhances the performance of electronic devices but also contributes to the overall efficiency of manufacturing processes.

Collaborations

Liu collaborates with notable colleagues such as Guofeng Xia and Tong An. Their combined expertise fosters a dynamic research environment that encourages innovation and the sharing of ideas.

Conclusion

Chengyan Liu's contributions to electronic device manufacturing through his patents and collaborative efforts highlight his role as a leading inventor in the industry. His work continues to pave the way for advancements in technology and manufacturing methods.