The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Dec. 04, 2012
Fei Qin, Beijing, CN;
Guofeng Xia, Beijing, CN;
Tong an, Beijing, CN;
Chengyan Liu, Beijing, CN;
Wei Wu, Beijing, CN;
Wenhui Zhu, Beijing, CN;
Fei Qin, Beijing, CN;
Guofeng Xia, Beijing, CN;
Tong An, Beijing, CN;
Chengyan Liu, Beijing, CN;
Wei Wu, Beijing, CN;
Wenhui Zhu, Beijing, CN;
Beijing University of Technology, Beijing, CN;
Abstract
A manufacturing method for Flip Chip on Chip (FCoC) package based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating first IC chip, second IC chip, solder bumps, underfill material, and metal wire to form an array of FCoC package based on the type of multi-row QFN package. Sawing and separating the FCoC package array, and forming FCoC package unit.