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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Cheng-Yuan Li

USPTO Granted Patents = 13

Average Co-Inventor Count = 4.5

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:

goldMedal13 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2017-2025

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13 patents (USPTO):
1. 12218051 - Method of manufacturing a semiconductor device including a plurality of circuit components and array of conductive contacts (2025-02-04),
2. 12199036 - Low resistance interconnect structure for semiconductor device (2025-01-14),
3. 12068246 - Redistribution layer layouts on integrated circuits and methods for manufacturing the same (2024-08-20),
4. 12021054 - Redistribution layer (RDL) layouts for integrated circuits (2024-06-25),
5. 12009323 - Semiconductor structure (2024-06-11),
6. 11817472 - Anchor structures and methods for uniform wafer planarization and bonding (2023-11-14),
7. 11791299 - Redistribution layer (RDL) layouts for integrated circuits (2023-10-17),
8. 11476191 - Low resistance interconnect structure for semiconductor device (2022-10-18),
9. 11456263 - Semiconductor structure and method for forming the same (2022-09-27),
10. 11152417 - Anchor structures and methods for uniform wafer planarization and bonding (2021-10-19),
11. 10692826 - Semiconductor structure and method for forming the same (2020-06-23),
12. 10276616 - Image sensor device (2019-04-30),
13. 9559135 - Conduction layer for stacked CIS charging prevention (2017-01-31),

Title: Innovations of Cheng-Yuan Li in Semiconductor Technology

Introduction

Cheng-Yuan Li is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work focuses on improving the manufacturing processes and interconnect structures of semiconductor devices.

Latest Patents

One of his latest patents is titled "Method of manufacturing a semiconductor device including a plurality of circuit components and array of conductive contacts." This patent discloses exemplary embodiments for redistribution layers of integrated circuit components. The redistribution layers include one or more arrays of conductive contacts that are designed to allow a bonding wave to displace air between the layers during bonding. This innovative configuration minimizes discontinuities, such as pockets of air, thereby enhancing the bonding process.

Another notable patent is "Low resistance interconnect structure for semiconductor device." This patent describes an interconnect structure and the method for forming it. The structure includes a substrate, a layer of conductive material, a metallic capping layer, and a layer of insulating material. Additionally, it features a trench conductor formed within the insulating material and the metallic capping layer, which contributes to improved performance in semiconductor devices.

Career Highlights

Cheng-Yuan Li is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approaches have positioned him as a key figure in advancing semiconductor technologies.

Collaborations

Cheng-Yuan Li has collaborated with notable colleagues, including Kuo-Cheng Lee and Yen-Liang Lin. Their combined efforts have contributed to the development of cutting-edge semiconductor solutions.

Conclusion

Cheng-Yuan Li's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape the future of semiconductor manufacturing and interconnect structures.

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