Company Filing History:
Years Active: 2017-2025
Title: Innovations by Cheng-Yuan Ko: A Pioneer in Chemical Mechanical Polishing
Introduction: Cheng-Yuan Ko, an accomplished inventor based in New Taipei, Taiwan, has made significant strides in the field of chemical mechanical polishing. With a total of five patents to his name, he has contributed innovative solutions that enhance the efficiency and effectiveness of polishing technologies used in various industries.
Latest Patents: Ko's most recent patents include groundbreaking compositions for chemical mechanical polishing. One notable invention is a CMP composition that features anionic and cationic inhibitors. This composition, designed specifically for polishing tungsten or molybdenum substrates, consists of a water-based liquid carrier, abrasive particles, and amino acids like arginine and lysine, alongside optional surfactants. Another significant patent involves a titanium dioxide-based polishing slurry for substrates containing ruthenium. This formulation also contains titanium oxide particles and is effective in achieving a controlled pH range optimal for polishing applications.
Career Highlights: Throughout his career, Cheng-Yuan Ko has been associated with reputable companies, including Cabot Microelectronics Corporation and CMC Materials, Inc. His contributions in these companies have solidified his reputation as an expert in the field, where he has played a pivotal role in advancing polishing technologies.
Collaborations: Ko has collaborated with esteemed professionals such as Roman A. Ivanov and Fred Sun. These partnerships have fostered a creative environment that has led to significant developments in chemical mechanical polishing technologies.
Conclusion: Cheng-Yuan Ko exemplifies innovation in the field of chemical mechanical polishing through his inventive contributions and collaborative efforts. His patents reflect a commitment to excellence and a drive to push the boundaries of technology, offering solutions that continue to impact the industry positively. As he continues to develop new innovations, the future holds promising advancements that could reshape polishing methodologies.