Hsinchu, Taiwan

Cheng-Yen Hsieh

USPTO Granted Patents = 5 

Average Co-Inventor Count = 3.2

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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5 patents (USPTO):

Title: The Innovative Mind of Cheng-Yen Hsieh

Introduction

Cheng-Yen Hsieh, an accomplished inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor technology. With a total of four patents to his name, Hsieh is recognized for his innovative designs and methodologies that enhance the efficiency and functionality of electronic components.

Latest Patents

Hsieh's most recent patents showcase his expertise in the integration of thermoelectric elements within semiconductor structures. One notable invention is a package structure comprising a semiconductor die with thermoelectric elements and a manufacturing method thereof. This innovative package structure features a semiconductor die with a thermoelectric structure that includes P-type and N-type semiconductor blocks, along with metal pads connecting them. This configuration allows for the formation of a cold junction that absorbs heat generated by the semiconductor die. Hsieh has also developed a similar package structure comprising a semiconductor die with a thermoelectric structure, confirming the utility and effectiveness of his designs in thermal management within electronic devices.

Career Highlights

Cheng-Yen Hsieh currently works with Taiwan Semiconductor Manufacturing Company Limited, a leader in semiconductor fabrication. His role at such a prestigious company underscores his standing as an expert in the field. Throughout his career, Hsieh has continually pushed the boundaries of technology, driving advancements that benefit various industries reliant on semiconductor technology.

Collaborations

Hsieh frequently collaborates with talented individuals in his field, including notable coworkers such as Chih-Horng Chang and Chung-Yu Lu. These collaborations have further enriched his innovative pursuits, allowing for a fusion of ideas that leads to groundbreaking inventions in semiconductor technology.

Conclusion

Cheng-Yen Hsieh's contributions to semiconductor innovation are both impressive and essential for the advancement of modern electronics. With a clear focus on improving thermal management through his inventive package structures, Hsieh continues to play a crucial role in the evolution of semiconductor technology. His ongoing work inspires future innovations that will shape the landscape of electronic engineering.

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