Cheng-Te Lin

Title: Cheng-Te Lin: Innovator in Electrostatic Discharge Devices and Wafer Level Packaging

Introduction

Cheng-Te Lin is a prominent inventor based in Taipei Hsien, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of electrostatic discharge devices and wafer level packaging. With a total of seven patents to his name, Lin's work has had a substantial impact on the industry.

Latest Patents

One of Lin's latest patents is an electrostatic discharge device. This device includes a substrate with a deep doped well of a first conductive type and a drain doped well of the same type disposed above it. An inserted doping well of a second conductive type is in contact with the deep doped well, while a drain region of the first conductive type is positioned above the inserted doping well. Additionally, a source doped well of the second conductive type is included, along with a gate structure situated between the drain and source regions.

Another notable patent is a wafer level package structure. The method for forming this structure involves covering a silicon chip with an insulation layer and creating bonding pads that connect to integrated circuit devices. A passivation layer is then deposited, followed by the formation of a metallic layer and packaging material. Finally, metallic bumps are created over the exposed metallic layer.

Career Highlights

Cheng-Te Lin has worked with several notable companies throughout his career, including United Microelectronics Corporation and Molex Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Lin has collaborated with several professionals in his field, including Min-Chih John Hsuan and Li-Cih Wang. These collaborations have further enhanced his work and led to advancements in technology.

Conclusion

Cheng-Te Lin is a distinguished inventor whose contributions to electrostatic discharge devices and wafer level packaging have made a lasting impact on the electronics industry. His innovative patents and collaborations with industry professionals highlight his commitment to advancing technology.