Cheng-Mu Lin

Title: Cheng-Mu Lin: Innovator in Wafer Topography Correction

Introduction

Cheng-Mu Lin is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of wafer topography correction. With a total of 3 patents to his name, Lin's work has had a substantial impact on the industry.

Latest Patents

One of Lin's latest patents is a system and method for correcting non-ideal wafer topography. This innovative scanner includes a light source that applies light to the backside of a wafer. The light is then reflected from the backside of the wafer. A first mirror is configured to receive the light from the backside and reflect it. A sensor is designed to receive the light from the first mirror and generate an output signal indicative of the backside topography of the wafer. This technology enhances the precision of wafer manufacturing processes.

Career Highlights

Cheng-Mu Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in wafer topography has positioned him as a key player in advancing manufacturing techniques.

Collaborations

Lin has collaborated with notable colleagues such as Chi-Hung Liao and Yi-Ming Dai. Their combined efforts contribute to the ongoing innovation within the semiconductor sector.

Conclusion

Cheng-Mu Lin's work in wafer topography correction exemplifies the importance of innovation in semiconductor manufacturing. His patents and collaborations continue to drive advancements in the industry.