The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Jun. 17, 2022
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Cheng-Mu Lin, Hsin-Chu, TW;
Chi-Hung Liao, Sanchong, TW;
Yi-Ming Dai, Hsinchu, TW;
Yueh Lin Yang, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); G06T 7/00 (2017.01); H01L 21/67 (2006.01); H04N 23/56 (2023.01);
U.S. Cl.
CPC ...
H01L 21/682 (2013.01); G06T 7/0004 (2013.01); H01L 21/67288 (2013.01); H01L 21/681 (2013.01); H04N 23/56 (2023.01); G06T 2207/10152 (2013.01); G06T 2207/30148 (2013.01);
Abstract
A scanner includes a light source configured to apply a light to a backside of a wafer. The light is reflected from the backside of the wafer. A first mirror is configured to receive the light from the backside of the wafer and reflect the light. A sensor is configured to receive the light from the first mirror and generate an output signal indicative of a backside topography of the wafer.