This inventor holds 2 USPTO granted patents. Top assignee: Via Technologies, Inc.. Active years: 2008-2009.
Location History:
- Hsin-Tien, TW (2008)
- Taipei Hsien, TW (2009)
Company Filing History:
Years Active: 2008-2009
Title: Cheng-Ming Hsu: Innovator in Electronic Assembly Technologies
Introduction
Cheng-Ming Hsu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic assembly technologies. With a total of 2 patents, his work focuses on enhancing the performance and reliability of electronic devices.
Latest Patents
Hsu's latest patents include innovative designs aimed at improving electronic assemblies. One of his patents is for a cooling module against electrostatic discharge (ESD) and an electronic package, assembly, and system using the same. This invention features a substrate with a bonding surface, a chip bonded to that surface, a conductive fence surrounding the chip, and a heat sink positioned above the substrate. The conductive fence serves to shield the chip from ESD currents, thereby reducing potential damage.
Another patent is for a fixed pillar with heat loss, designed to efficiently dissipate heat. This invention consists of a hollow metal body with screw threads and grooves that facilitate airflow. Air enters one side of the metal body, flows through its interior, and exits from the other side, allowing for rapid thermal energy exchange.
Career Highlights
Cheng-Ming Hsu is currently employed at Via Technologies, Inc., where he continues to develop innovative solutions in electronic assembly. His work has been instrumental in advancing the technology used in various electronic devices.
Collaborations
Hsu collaborates with talented individuals such as Stanley Huang and Kevin Kuo, contributing to a dynamic work environment that fosters innovation.
Conclusion
Cheng-Ming Hsu's contributions to electronic assembly technologies through his patents demonstrate his commitment to innovation in the field. His work not only enhances device performance but also addresses critical issues such as ESD protection and heat dissipation.