Via Technologies, Inc.

Cheng-Ming Hsu

Neng-An Kuo

Stanley Huang

Yi-Cheng Kuo

Kevin Kuo

Chi-Chang Chang

An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.

Cooling module against ESD and electronic package, assembly and system using the same

A fixed pillar with heat loss is a fixed pillar for losing heat. The fixed pillar with heat loss includes a metal body, a screw thread and a plurality of grooves. The metal body is a hollow body. The plurality of grooves is respectively set on two sides of the metal body and communicating with each other. The screw thread is set on one end of the metal body to fix a circuit or other electric devices. Air flows into one side of the metal body and then passes through the inner part of the metal body and last flow out from another side of the metal body. Accordingly, the metal body exchanges heat with the air to lose the thermal energy quickly.

Growing community of inventors

Taipei Hsien, Taiwan

Cheng-Ming Hsu