The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2009
Filed:
Oct. 30, 2006
Kevin Kuo, Taipei Hsien, TW;
Stanley Huang, Taipei Hsien, TW;
Cheng-ming Hsu, Taipei Hsien, TW;
Neng-an Kuo, Taipei Hsien, TW;
Kevin Kuo, Taipei Hsien, TW;
Stanley Huang, Taipei Hsien, TW;
Cheng-Ming Hsu, Taipei Hsien, TW;
Neng-An Kuo, Taipei Hsien, TW;
VIA Technologies, Inc., Taipei Hsien, TW;
Abstract
An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.