This inventor holds 1 USPTO granted patent. Top assignee: Via Technologies, Inc.. Active years: 2009.
Company Filing History:
Years Active: 2009
Title: Kevin Kuo: Innovator in Electronic Assembly Technology
Introduction
Kevin Kuo is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic assembly technology. His innovative work focuses on enhancing the reliability and performance of electronic devices.
Latest Patents
Kevin Kuo holds a patent for a "Cooling module against ESD and electronic package, assembly and system using the same." This invention involves an electronic assembly that includes a substrate, a chip, a conductive fence, and a heat sink. The substrate features a bonding surface where the chip is securely bonded. The conductive fence connects to the bonding surface and surrounds the chip's sides. The heat sink is positioned over the substrate, making contact with both the chip and the conductive fence. This design allows the conductive fence and heat sink to act as shields, effectively reducing the adverse effects of electrostatic discharge (ESD) currents on the chip. Kevin Kuo has 1 patent to his name.
Career Highlights
Kevin Kuo is currently employed at Via Technologies, Inc., where he continues to develop innovative solutions in electronic assembly. His work has been instrumental in advancing the technology used in various electronic devices.
Collaborations
Some of Kevin's notable coworkers include Stanley Huang and Cheng-Ming Hsu. Their collaborative efforts contribute to the innovative environment at Via Technologies, Inc.
Conclusion
Kevin Kuo is a dedicated inventor whose work in electronic assembly technology has made a significant impact. His patent for a cooling module against ESD showcases his commitment to improving electronic device reliability.