Cheng-Kang Huang

Title: Cheng-Kang Huang: Innovator in Semiconductor Packaging

Introduction

Cheng-Kang Huang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of his latest patents is a semiconductor package that includes a test line structure. This innovative package comprises an interposer, which includes an interposer substrate with at least one layer and a plurality of redistribution layers (RDLs) formed through a portion of the interposer substrate. The package also features a die device structure that includes at least one device die, along with a first test line (TL) structure interposed between the interposer and the die device structure. The first TL structure includes at least one first test line that is electrically coupled to the device die, with a portion of the first test line extending beyond the peripheral edge of the die device structure to provide an electrical interface with the device die.

Career Highlights

Cheng-Kang Huang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing semiconductor technology and improving packaging solutions.

Collaborations

He has collaborated with notable coworkers, including Tsung-Yang Hsieh and Chia-Ping Lai, contributing to various projects that enhance semiconductor packaging technologies.

Conclusion

Cheng-Kang Huang's innovative work in semiconductor packaging has made a significant impact on the industry. His patents reflect his commitment to advancing technology and improving device performance.