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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12261133 B1

PDFFull Text
Date of Patent:
Mar. 25, 2025

Filed:

Apr. 08, 2024

Interposer with warpage-relief trenches

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Tsung-Yang Hsieh, Taipei, TW;

Chien-Chang Lee, Miaoli County, TW;

Chia-Ping Lai, Hsinchu, TW;

Wen-Chung Lu, Hsinchu, TW;

Cheng-Kang Huang, Hsinchu, TW;

Mei-Shih Kuo, Hsinchu, TW;

Chih-Ai Huang, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Kilpatrick Townsend & Stockton LLP

Primary Examiner:

Errol V Fernandes

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4846 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01);
Abstract

A method is provided for forming an integrated circuit (IC) chip package structure. The method includes: providing an interposer having a front surface and a back surface, the interposer comprising a substrate, at least one routing region, and at least one non-routing region; forming at least one warpage-reducing trench in the at least one non-routing region, wherein the at least one warpage-reducing trench extends from the front surface of the interposer to a first depth, the first depth smaller than a thickness between the front surface and the back surface of the interposer; depositing a warpage-relief material in the at least one warpage-reducing trench; and bonding the group of IC dies to the front surface of the interposer.

Find Patent Forward Citations

Hsieh, Tsung-Yang. (2025). Interposer with warpage-relief trenches (U.S. Patent No. 12261133). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12261133

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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