Cheng-Hui Lin

Title: Innovations by Cheng-Hui Lin

Introduction

Cheng-Hui Lin is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electronic testing devices, holding a total of three patents. His work focuses on enhancing the efficiency and accuracy of testing methods for electronic components.

Latest Patents

One of Cheng-Hui Lin's latest patents is an electronic test device that includes a test seat and at least one probe. The test seat features a hole-defining surface that defines a probe hole, with two positioning sections located at opposite ends of the probe hole. The design includes at least one first protrusion and at least one second protrusion, which are crucial for the device's functionality. The thickness of these protrusions ranges from five to thirty percent of the probe hole's depth.

Another significant patent is a testing method for wafer level chip scale packages. This method involves a test device that includes a probe card with multiple parallel probe holes and probes that connect to contact electrodes on a wafer substrate. The distance between the axes of adjacent probe holes is designed to match the smallest spacing between contact electrodes, ensuring precision in testing.

Career Highlights

Cheng-Hui Lin is currently employed at Winway Technology Co., Ltd., where he continues to innovate in the field of electronic testing. His work has been instrumental in developing advanced testing solutions that cater to the needs of the electronics industry