Taichung, Taiwan

Cheng-Chia Chiang

USPTO Granted Patents = 10 

Average Co-Inventor Count = 5.1

ph-index = 3

Forward Citations = 50(Granted Patents)


Location History:

  • Taichung Hsien, TW (2012)
  • Taichung, TW (2004 - 2018)

Company Filing History:


Years Active: 2004-2018

Loading Chart...
10 patents (USPTO):Explore Patents

Title: Innovations of Cheng-Chia Chiang in Semiconductor Packaging

Introduction

Cheng-Chia Chiang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 10 patents. His work focuses on enhancing the efficiency and reliability of semiconductor packages, which are crucial components in modern electronics.

Latest Patents

One of his latest patents is a fabrication method of a semiconductor package. This innovation includes a packaging substrate with opposite first and second surfaces, featuring a plurality of conductive pads. A chip is placed on the first conductive pads, and conductive posts are formed on the second conductive pads. The design incorporates a first encapsulant that protects the chip and interconnection structure from moisture intrusion, thereby increasing package density.

Another notable patent is related to a package on package (PoP) structure and its fabrication method. This method involves providing a first packaging substrate with an electronic element and support portions. An encapsulant is formed to encapsulate these components, and openings are created to expose portions of the support surfaces. A second packaging substrate is then stacked on the first, ensuring effective separation to prevent bridging between the support portions.

Career Highlights

Cheng-Chia Chiang is currently employed at Siliconware Precision Industries Co., Ltd. His work at this leading company in semiconductor packaging has positioned him as a key figure in the industry. His innovative approaches have contributed to advancements in packaging technology, making significant impacts on the performance of electronic devices.

Collaborations

Cheng-Chia has collaborated with notable colleagues, including Lung-Yuan Wang and Chih-Ming Huang. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas in semiconductor technology.

Conclusion

Cheng-Chia Chiang's contributions to semiconductor packaging through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence the development of more efficient and reliable electronic components.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…