Cheng-Chang Shen

Title: Cheng-Chang Shen: Innovator in Semiconductor Packaging

Introduction

Cheng-Chang Shen is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions.

Latest Patents

Cheng-Chang Shen holds a patent for a semiconductor package structure and encapsulating module for molding the same. This invention provides an encapsulating mold used for packaging a substrate that contains a chip. The mold features a pressing surface, a smooth surface, and a cavity. The smooth surface, which has a curvature radius, connects with the pressing surface and is located at the mouth of the cavity. When the encapsulating mold is joined with an encapsulating lower mold to hold the substrate, the pressing surface effectively contacts and presses the substrate.

Career Highlights

Cheng-Chang Shen is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the efficiency and effectiveness of semiconductor packaging.

Collaborations

Cheng-Chang Shen has collaborated with notable colleagues, including Chen-Tsung Chang and Chih-Yuan Lin. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Cheng-Chang Shen's contributions to semiconductor packaging highlight his role as a key innovator in the industry. His patent and ongoing work at Advanced Semiconductor Engineering, Inc. reflect his commitment to advancing technology in this critical field.