The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Oct. 14, 2009
Cheng-chang Shen, Kaohsiung, TW;
Chen-tsung Chang, Fengshan, TW;
Chih-yuan Lin, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A semiconductor package structure and encapsulating module for molding the same and an encapsulating mold for molding the same are provided. The encapsulating mold is used for packaging a substrate having a chip so as to mold the substrate having the chip as a package structure. The encapsulating mold has a pressing surface, a smooth surface and a cavity. The smooth surface having a curvature radius is connected with the pressing surface and disposed at a mouth of the cavity. When the encapsulating mold and an encapsulating lower mold are jointed to hold the substrate, the pressing surface contacts and presses the substrate.