Cheng-An Peng

Title: Cheng-An Peng: Innovator in Chemical Mechanical Polishing

Introduction

Cheng-An Peng is a notable inventor based in Pingtung, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP), with a focus on improving the uniformity control of wafers during the polishing process. With a total of 3 patents to his name, his work has had a substantial impact on the semiconductor industry.

Latest Patents

Cheng-An Peng's latest patents include innovative methods that enhance the CMP process. One of his patents is titled "Method of improving uniformity control on wafers during chemical mechanical polishing." This method involves a CMP apparatus that includes a platen, a polishing pad, and a polishing carrier. The apparatus is designed to rotate in multiple directions to improve the uniformity of the polishing process.

Another significant patent is "Chemical mechanical polishing method for slurry free fixed abrasive pads." This method utilizes an aqueous solution with a variable pH, allowing for precise control over the polishing process. By adjusting the pH, the removal rate and selectivity between oxide and nitride can be effectively managed.

Career Highlights

Cheng-An Peng is currently employed at Promos Technologies, Inc., where he continues to develop innovative solutions in the field of CMP. His expertise and dedication to advancing technology have positioned him as a key figure in his industry.

Collaborations

Cheng-An has collaborated with talented coworkers such as Jiun-Fang Wang and Guan-Jiun Yi. Their combined efforts contribute to the ongoing advancements in chemical mechanical polishing technologies.

Conclusion

Cheng-An Peng's contributions to the field of chemical mechanical polishing demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in wafer processing, making him a valuable asset to the semiconductor industry.