Boise, ID, United States of America

Chender Huang


Average Co-Inventor Count = 3.6

ph-index = 6

Forward Citations = 586(Granted Patents)


Company Filing History:


Years Active: 1992-2006

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7 patents (USPTO):Explore Patents

Title: The Innovations of Chender Huang

Introduction

Chender Huang is a notable inventor based in Boise, ID (US), recognized for his contributions to semiconductor technology. With a total of seven patents to his name, Huang has made significant advancements in the field of burn-in testing for semiconductor dice. His work has been instrumental in improving the reliability and efficiency of electronic components.

Latest Patents

Huang's latest patents include a "Method for burn-in testing semiconductor dice" and "Discrete die burn-in for nonpackaged die." Both patents describe a reusable burn-in/test fixture for discrete TAB die, which consists of two halves. The first half of the test fixture contains a cavity in which the die is inserted. When the two halves are assembled, the fixture establishes electrical contact with the die and with a burn-in oven. The test fixture need not be opened until the burn-in and electrical test are completed. This innovative fixture allows for the characterization of the die prior to assembly, enhancing the testing process.

Career Highlights

Throughout his career, Chender Huang has worked with prominent companies, including Micron Technology Incorporated. His experience in the semiconductor industry has equipped him with the knowledge and skills necessary to develop groundbreaking technologies.

Collaborations

Huang has collaborated with notable colleagues such as Alan G Wood and Tim J Corbett. These partnerships have contributed to the success of his projects and the advancement of semiconductor testing methodologies.

Conclusion

Chender Huang's contributions to the field of semiconductor technology through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and improve the reliability of electronic components.

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