Taoyuan, Taiwan

Chen-Yang Hsieh

This inventor holds 1 USPTO granted patent. Top assignee: Win Semiconductors Corp.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chen-Yang Hsieh. Retrieved from https://idiyas.com/inventor/chen-yang-hsieh-7sg1jo4l

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: The Innovations of Chen-Yang Hsieh

Introduction

Chen-Yang Hsieh is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology. His work focuses on enhancing the efficiency and functionality of electronic packages.

Latest Patents

One of Chen-Yang Hsieh's key patents is titled "Transition structure and high-frequency package." This patent describes a transition structure that is disposed in a package. The transition structure comprises a first ground lead, a second ground lead, and a signal lead. The signal lead is positioned between the first and second ground leads. Notably, the exterior gap between the ground leads is wider than the interior gap, which optimizes the performance of the package.

Career Highlights

Chen-Yang Hsieh is currently employed at Win Semiconductors Corp., where he continues to innovate in the semiconductor industry. His expertise in high-frequency packages has positioned him as a valuable asset to his company.

Collaborations

Throughout his career, Chen-Yang Hsieh has collaborated with talented individuals such as Chih-Wen Huang and Jui-Chieh Chiu. These collaborations have furthered advancements in semiconductor technologies.

Conclusion

Chen-Yang Hsieh's contributions to the field of semiconductor technology, particularly through his patent on transition structures, highlight his innovative spirit and dedication to improving electronic packaging. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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