The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Feb. 07, 2018
Applicant:

Win Semiconductors Corp., Tao Yuan, TW;

Inventors:

Jui-Chieh Chiu, Taoyuan, TW;

Chih-Wen Huang, Taoyuan, TW;

Chen-Yang Hsieh, Taoyuan, TW;

You-Cheng Lai, Taoyuan, TW;

Assignee:

WIN Semiconductors Corp., Tao Yuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/4952 (2013.01); H01L 23/49541 (2013.01); H01L 23/49838 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/04042 (2013.01);
Abstract

A transition structure disposed in a package is disclosed. The transition structure comprises a first ground lead and a second ground lead; and a signal lead, disposed between the first ground lead and the second ground lead, wherein the first ground lead and the second ground lead have an exterior edge and an interior edge, the signal lead is coupled to a metal line formed on a printed circuit board (PCB) and a signal terminal of the die within the package; wherein an exterior gap formed between the first ground lead and the second ground lead at the exterior edge is wider than an interior gap formed between the first ground lead and the second ground lead at the interior edge.


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