Chen-Hui Huang

Title: Innovations of Chen-Hui Huang

Introduction

Chen-Hui Huang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in wafer defect detection. With a total of 4 patents to his name, his work has advanced the methods used in the industry.

Latest Patents

Huang's latest patents include a wafer backside defect detection method and apparatus. This method involves cropping off a peripheral edge area of a wafer backside image where at least one notch is located. It connects adjacent white pixels to identify abnormal regions. If the total area of the top N abnormal regions exceeds 10% of the wafer area, it indicates a roughness defect. Conversely, if it is less than 1% and the largest abnormal region exceeds a predetermined length, it suggests a scratch defect.

Another significant patent is an automatic detection method and system for identifying cracks on wafer edges. This method obtains several wafer images, integrates them to create a template image, and compares each wafer image with the template to generate differential images. These images are then binarized and de-noised to detect edge cracks based on their patterns.

Career Highlights

Chen-Hui Huang is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His innovative work has positioned him as a key figure in advancing wafer inspection technologies.

Collaborations

Huang collaborates with talented individuals such as Tzu-Ping Kao and Cheng-Hsien Chen, who contribute to his research and development efforts.

Conclusion

Chen-Hui Huang's contributions to wafer defect detection have significantly impacted the semiconductor industry. His innovative patents reflect his expertise and commitment to advancing technology in this field.