Company Filing History:
Years Active: 2018-2019
Title: Innovations of Chen-Hsi Lin
Introduction
Chen-Hsi Lin is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic devices, holding a total of 2 patents. His work focuses on advanced methods for fabricating stacked electronic devices and package devices.
Latest Patents
Chen-Hsi Lin's latest patents include "Stacked electronic device and method for fabricating the same" and "Stacked package device and method for fabricating the same." The first patent describes a method involving three-dimensional (3D) printing to create a stacked electronic device. This process includes forming insulating layers, redistribution layers, and through-substrate vias that are electrically connected. The second patent outlines a method for fabricating a stacked package device, which involves adhering substrates and forming encapsulating layers through 3D printing.
Career Highlights
Chen-Hsi Lin is currently employed at Winbond Electronics Corporation, where he continues to innovate in the field of electronics. His work has contributed to advancements in the manufacturing processes of electronic devices, enhancing their efficiency and functionality.
Collaborations
Some of his notable coworkers include Yu-Cheng Chiao and Tung-Yi Chan, who collaborate with him on various projects within the company.
Conclusion
Chen-Hsi Lin's contributions to the field of electronics through his innovative patents and work at Winbond Electronics Corporation highlight his role as a key inventor in advancing technology. His methods for fabricating electronic devices are paving the way for future innovations in the industry.