The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Feb. 04, 2016
Winbond Electronics Corp., Taichung, TW;
Yu-Cheng Chiao, Taichung, TW;
Tung-Yi Chan, Taichung, TW;
Chen-Hsi Lin, Taichung, TW;
Chia Hua Ho, Hsinchu, TW;
Meng-Chang Chan, Taichung, TW;
Hsin-Hung Chou, Changchua, TW;
WINBOND ELECTRONICS CORP., Taichung, TW;
Abstract
A method for fabricating a stacked package device is provided. A second substrate is adhered onto a first substrate. The first substrate includes a plurality of first bonding pads, and the second substrate includes a plurality of second bonding pads. A three-dimensional (3D) printing is performed to form an encapsulating layer covering the first substrate and the second substrate and to form a plurality of bonding wires in the encapsulating layer. Each bonding wire includes a first portion connected to one of the plurality of first bonding pads. The disclosure also provides a stacked package device formed by such a method.