Company Filing History:
Years Active: 2013-2014
Title: Innovations of Chen-Feng Chang in Flip Chip Packaging
Introduction: Chen-Feng Chang is a renowned inventor based in Taipei, Taiwan, who has made significant contributions to the field of flip chip packaging. With two patents to his name, he has demonstrated a keen understanding of routing methods for flip chip packages. His work has implications for electronics and semiconductor industries, where efficient connectivity is essential.
Latest Patents: Chen-Feng Chang's latest patents include a routing method for flip chip packages and the apparatus utilizing this innovative technique. The disclosed methods and devices simplify the routing process for flip chips, which consist of several outer paddings and inner pads. The routing method involves setting an outer sequence that aligns with the arrangement of the outer pads and establishing inner sequences based on how inner pads connect to outer pads. By calculating the longest common subsequence for each inner sequence and the outer sequence, this method identifies direct and detour connection relationships, thereby facilitating a robust routing scheme for flip chips.
Career Highlights: Chang is currently affiliated with Synopsys, Inc., where he contributes his expertise in advancing semiconductor technology. His career is marked by his dedication to improving the efficiency of electronic packaging solutions, which are crucial for modern devices.
Collaborations: Throughout his career, Chen-Feng Chang has collaborated with notable coworkers such as Chin-Fang Shen and Hsien-Shih Chiu. Their partnerships have likely fostered innovative solutions in the realm of electronic packaging, enhancing the collective impact of their work within the industry.
Conclusion: The innovations brought forth by Chen-Feng Chang in flip chip packaging exemplify the critical role inventors play in the advancement of technology. With a foundation built on his latest patents and valuable collaborations, he continues to influence the electronics sector, ensuring that connectivity challenges in semiconductor applications are effectively addressed.