The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2013
Filed:
Oct. 27, 2010
Chen-feng Chang, Taipei, TW;
Chin-fang Shen, Taipei, TW;
Hsien-shih Chiu, Taipei, TW;
I-jye Lin, Taipei, TW;
Tien-chang Hsu, Taipei, TW;
Yao-wen Chang, Taipei, TW;
Chun-wei Lin, Taipei, TW;
Po-wei Lee, Taipei, TW;
Chen-Feng Chang, Taipei, TW;
Chin-Fang Shen, Taipei, TW;
Hsien-Shih Chiu, Taipei, TW;
I-Jye Lin, Taipei, TW;
Tien-Chang Hsu, Taipei, TW;
Yao-Wen Chang, Taipei, TW;
Chun-Wei Lin, Taipei, TW;
Po-Wei Lee, Taipei, TW;
Synopsys, Inc., Mountain View, CA (US);
Abstract
Disclosed herein are rouging methods and devices for a flip-chip package. The flip chip includes several outer pads and several inner pads. The routing method includes: setting an outer sequence based on the arrangement order of the outer pads; setting several inner sequences based on the connection relationships between inner pads and the outer pads; calculating the longest common subsequence of each inner sequence and the outer sequence, defining the connection relationships between the inner pads and the outer pads corresponding to the longest common subsequence as direct connections, and defining the connection relationships between the inner pads and the outer pads that do not correspond to the longest common subsequence as detour connections; establishing the routing scheme of the flip chip based on the connection relationships between the inner pads and the outer pads.