Company Filing History:
Years Active: 2013-2014
Title: Innovations of Chun-Wei Lin
Introduction
Chun-Wei Lin is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in the area of flip-chip packaging. With a total of 2 patents to his name, Lin's work showcases his expertise and innovative thinking.
Latest Patents
One of Chun-Wei Lin's latest patents is titled "Routing method for flip chip package and apparatus using the same." This patent discloses routing methods and devices for a flip-chip package. The flip chip includes several outer pads and several inner pads. The routing method involves setting an outer sequence based on the arrangement order of the outer pads. It also includes setting several inner sequences based on the connection relationships between inner pads and the outer pads. The method calculates the longest common subsequence of each inner sequence and the outer sequence. It defines the connection relationships between the inner pads and the outer pads corresponding to the longest common subsequence as direct connections. Additionally, it defines the connection relationships that do not correspond to the longest common subsequence as detour connections. Ultimately, the routing scheme of the flip chip is established based on these connection relationships.
Career Highlights
Chun-Wei Lin is currently employed at Synopsys, Inc., where he continues to develop innovative solutions in his field. His work at Synopsys has allowed him to collaborate with other talented professionals and contribute to cutting-edge technology.
Collaborations
Some of his notable coworkers include Chen-Feng Chang and Chin-Fang Shen. Their collaboration has likely fostered an environment of creativity and innovation, further enhancing the impact of their work.
Conclusion
Chun-Wei Lin's contributions to the field of technology, particularly through his patents and work at Synopsys, highlight his role as an influential inventor. His innovative routing methods for flip-chip packages demonstrate his commitment to advancing technology.