Chee Seng Leong

Title: Chee Seng Leong: Innovator in Integrated Circuit Technology

Introduction

Chee Seng Leong is a prominent inventor based in Gelugor, Malaysia. He has made significant contributions to the field of integrated circuit technology, holding a total of 11 patents. His work focuses on enhancing the efficiency and functionality of modularized integrated circuit devices.

Latest Patents

One of his latest patents is titled "Fabric die to fabric die interconnect for modularized integrated circuit devices." This invention features a programmable fabric die that includes a direct interconnect interface column, allowing for low latency connections between fabric dies. The design aims to reduce routing congestion and improve overall performance. Another notable patent is "Device, method and system to determine calibration information with a shared ring oscillator circuit." This patent outlines techniques for determining calibration information through the tuning of a ring oscillator circuit formed with two integrated circuit dies, enhancing the accuracy of transmitter circuitry.

Career Highlights

Chee Seng Leong has worked with leading technology companies, including Intel Corporation and Altera Corporation. His experience in these organizations has allowed him to develop innovative solutions that address complex challenges in integrated circuit design.

Collaborations

Throughout his career, Chee Seng Leong has collaborated with notable colleagues such as Chee Hak Teh and Lai Guan Tang. These partnerships have contributed to the advancement of technology in their respective fields.

Conclusion

Chee Seng Leong's contributions to integrated circuit technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced electronic devices.