This inventor holds 3 USPTO granted patents and 18 published patent applications. Top assignee: Intel Corporation. Active years: 2021-2026.
Company Filing History:
Years Active: 2021-2026
Title: Chee Kheong Yoon: Innovator in Electronic Device Packaging
Introduction
Chee Kheong Yoon is a notable inventor based in Bayan Lepas, Malaysia. He has made significant contributions to the field of electronic device packaging. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of electronic devices.
Latest Patents
Chee Kheong Yoon holds a patent for an electronic device packaging. This invention involves a first package that includes a first substrate with a mounting surface. A first die is coupled to this mounting surface, while a first interconnect region is laterally spaced from the first die. The first package is interconnected with a second package, which contains a second die coupled to a second mounting surface. This interconnection establishes one or more electrical communication pathways between the two packages, allowing for effective communication between the first die and the second die.
Career Highlights
Chee Kheong Yoon is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has allowed him to collaborate with other talented professionals in the field, further enhancing his expertise and contributions to electronic device technology.
Collaborations
Some of his notable coworkers include Eng Huat Goh and Min Suet Lim. Their collaborative efforts contribute to the advancement of technology within the company.
Conclusion
Chee Kheong Yoon's work in electronic device packaging exemplifies innovation in the technology sector. His patent reflects a significant advancement in the field, showcasing his dedication to improving electronic device functionality.